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Material : |
XPC, FR1, FR2, CEM1, CEM3, FR4 |
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Finish : |
Lacquer, OSP (Glicoat F2) HAL, Lead FREE HAL, Electrolytic Gold,
Immersion Gold, Nickel Plating, Silver Jumpers |
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Technology : |
CNC Routing & Punching |
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Material : |
FR4, CEM3, |
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Finish : |
Lacquer, OSP (Glicoat F2) HAL, Lead FREE HAL, Electrolytic Gold,
Immersion Gold, Nickel Plating, Silver Jumpers |
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Technology : |
CNC routing and Blanking |
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Material : |
FR4, High Tg material, and others available |
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Finish : |
HAL, Lead FREE HAL, Immersion Gold |
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Technology : |
Up to 8 layers |
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Below is a summary over our current capability/capacity for standard mass production. We can also meet special requirement for your products upon request. |
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Layer Count : |
1 - 12 |
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Board Thickness : |
(Min / Max) |
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Single Sided : |
0.4 mm / 2.4 mm |
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Double Sided (PTH) : |
0.4 mm / 3.2 mm |
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4 Layer : |
0.6 mm / 3.2 mm |
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6 Layer : |
0.8 mm / 3.2 mm |
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Base Laminate Copper Weight : |
17 um to 105 um |
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Base Laminate Type : |
XPC, FR1, FR2, CEM1, CEM3, FR4 |
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Minimum Line Width / Space : |
0.13 mm / 0.10 mm |
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Minimum Hole Size (Finished) : |
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Punching Holes : |
0.7 mm |
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CNC Drilled non plated : |
0.3 mm |
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CNC Drilled plated : |
0.25 mm |
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Aspect Ratio : |
14 |
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Minimun Annular Ring Size : |
0.25 mm greater than hole size |
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Finished Board Size |
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Maximum : |
576x424mm |
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HASL : |
YES |
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OSP (Glicoat F2 or Lacquer) : |
YES |
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Electrolytic Gold : |
YES |
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Gold Finger : |
YES |
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Immersion Gold : |
YES |
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Others : |
Upon Special Request |
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Production Capacity per Month |
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Single Sided : |
45,000 m2 |
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Double Sided PTH : |
4,000 m2 |
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Multi Layer : |
5,000 m2 |
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