• 2017

    Addition of new machinery CNC Routers, CNC Jump scoring, Auto x-y V-cutting, 2-side edge chamfering, Centralised Chiller system

    Plant capacity enhanced to

    Single Sided PCBs – 30,000 Square metre/month
  • 2016

    Longest PCB (1.8 Mtrs.) fabricated for RF application Tie-up with IISc for improvement of ETP treated water quality
    Addition of rectifiers for plating – DS /ML Capacity increase to 14,000 SQ.M/month
    EHS certification (ISO 14001:2015 & BS/OHSAS 18001:2007) by Bureau Veritas

    Plant capacity enhanced to

    Double Sided PCBs – 14,000 Square metre/month
  • 2015

    Longest PCB (1.8 Mtrs.) fabricated for RF application
    Technology Tie-up with Japanese Consultants for planning machinery & investments for increasing ML Capacities upto 15000 Sq.M/month and lay-out design of new plant for Capacity Enhancement.
    Testing facilities (Lab) upgraded
    Initiation of LEAN Management Implementation

    Plant capacity enhanced to

    Multilayer PCBs – 2,000 Square metre/month
    RF PCBs – 8,000 Square metre/month
  • 2013

    FPT & Universal BBT facility added

    Plant capacity enhanced to

    Double Sided PCBs – 10,000 Square metre/month
  • 2012

    ISRO-ISAC Approval for On-board application
    Immersion Tin / ENIG facility added
    PIM (Passive Inter Modulation) test facility added

    Plant capacity enhanced to

    RF PCBs – 5,000 Square metre/month
  • 2010

    12 Layer PCB fabricated
    Aluminium backed (IMS – Insulated Metal Substrate) PCB fabricated for LED Lighting
    Final Cleaning facility
    Hybrid ML PCB (Composite material Rogers Ceramic + FR4) fabricated

    Plant capacity enhanced to

    Double Sided PCBs – 7,500 Square metre/month
    Multilayer PCBs – 1,000 Square metre/month
  • 2009

    Blind/Buried via PCB fabrication
    ETP facility upgraded & Mechanical Evaporator installed for Zero Discharge compliance
  • 2008

    CNC Drilling capacity / capability enhancement
    AOI (Automatic Optical Inspection) facility added
    FPT (Flying Probe Tester) facility upgraded
    RF & Microwave PCBs fabricated

    Plant capacity enhanced to

    RF PCBs – 2,000 Square metre/month
  • 2006

    Auto-registration facility for Photo imaging
    ML (4L & 6L) production started
    ETP, RO & DI plants upgraded & Solar Evaporator added
  • 2005

    Double side PCB production started
    ISO/TS 16949 approval by US-DQS
    Jump scoring facility added
    Vertical Coating machines added for PISM

    Plant capacity enhanced to

    Double Sided PCBs – 4,000 Square metre/month
    Multilayer PCBs – 500 Square metre/month
  • 2004

    Foundation laid for DS & ML facility
  • 2003

    Lead-free HAL facility added. First PCB Company in India to add this facility.
  • 2000

    6th April

    Company renamed as “Ascent Circuits Pvt. Ltd.” and ISO 9001 approval by UL-DQS
  • 1999

    1st February

    Company registered as “RIC Circuits Pvt. Ltd.”

    October

    Single side PCB production started

    Plant Installed Capacity

    Single Sided PCBs – 25,000 Square metre/month